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Semiconductor
Please click to see respective section:
BGA Substrate Inspection Surface Inspection
Leadframe Inspection Mark Inspection
 
BGA Substrate Inspection
 
Inspection Criteria: BGA

BGA
X-Y ball position of solder balls
Presence/ absence of solder balls
Solder ball deformities
Mold flashes on solder ball pads
   
   
   
   
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Surface Inspection
 
Inspection Criteria: TSOP

TSOP
Voids
Cracks
Contamination
Mold blisters
Scratches
Exposed die
Exposed wire
   
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Leadframe Inspection
 
Inspection Criteria: TSOP

TSOP
Uneven lead
Broken Y-tie
Air vent bleed
Broken tie bar
Mold Flash
Lead pitches
Lead sizes
Co-planarity
Standoffs
   
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Mark Inspection
 
Inspection Criteria: Mark Defect

Mark Defect
Double marking
Wrong marking
Broken marking
Scratched marking
Angled marking
Illegibility
Orientation
   
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Blk 25, Kallang Avenue #05-01 Kallang Basin Industrial Estate Singapore 339416.T (65) 6392 0990.F (65) 6392 2103.Company Registration No.: 200104387H
 
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